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5G NR-NTN: Design and Test Challenges for Satellite-Connected IoT

by Microwave Product Digest | Oct 11, 2026 | Feature Article

by Raghul Premkumar, Business Development/Applications Engineer, Anritsu Company For the past decade, cellular IoT has extended low-power connectivity to places where conventional network economics could not justify the deployment of terrestrial infrastructure. Even...

Taking 6G Waveform Generation Into Sub-Terahertz Bands

by Microwave Product Digest | Oct 10, 2026 | Feature Article

by Rohde & Schwarz Generating and analyzing candidate 6G waveforms above 100 GHz places demands on both the signal itself and the test equipment used to create it. The attraction of the sub-THz spectrum is straightforward: frequencies between 100 and 300 GHz offer...

What Defense Primes Are Really Buying

by Microwave Product Digest | Oct 9, 2026 | Feature Article

by Rich Sorelle, President and CEO, Spectrum Control I spent the first half of my career on the other side of this conversation. I started at Grumman working on Navy aircraft programs, including the F-14D, A-6F, and EA-6B Prowler. Then twenty years at ITT, later...
How Kohl’s Connected the Sales Floor Before Retail Embraced IoT

How Kohl’s Connected the Sales Floor Before Retail Embraced IoT

by Barry Manz | Aug 12, 2026 | Feature Article

European grocers pioneered electronic labels, but Kohl’s brought wireless signage to U.S. department stores at scale. More than 15 years ago, shoppers walking through Kohl’s stores encountered something remarkably advanced for its time. Mounted above clothing...

Polyfet’s RF Power Portfolio Spans VDMOS, LDMOS, and GaN

by Microwave Product Digest | Jul 22, 2026 | Feature Article

Polyfet RF Devices designs and manufactures RF power transistors and power amplifier modules for commercial, industrial, and defense systems. Its catalog spans three semiconductor technologies: VDMOS, LDMOS, and GaN. Across the portfolio, devices reach frequencies up...

Microwave Design Is Still Waiting for Its Chiplet Standard

by Microwave Product Digest | Jul 20, 2026 | Feature Article

The semiconductor industry is moving steadily toward chiplet-based design, and UCIe has become one of the most important pieces of that transition. Its purpose is to create a common die-to-die interconnect so chiplets from different vendors can communicate inside the...
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Recent Posts

  • Software-Defined Radio Product Survey
  • How RF Filters Protect Military Systems
  • Quantum Gravimeter Navigates Vessel Without GPS
  • 5G NR-NTN: Design and Test Challenges for Satellite-Connected IoT
  • Taking 6G Waveform Generation Into Sub-Terahertz Bands

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